Explore Moldex3D Solutions for IC Packaging Simulation
26 October 2021 | 2:00 PM – 4:00 PM SGT
Plastic chip encapsulation is a molding process where chips are being capsulated with epoxy molding compound (EMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.
Moldex3D IC Packaging provides a complete series of molding solutions that help engineers to simulate the complex chip encapsulation process, validate mold design, and optimize process conditions.
Join now to learn how to simulate and visualize such potential defects using Moldex3D. A demo on IC auto meshing will also be provided in this session. Don’t miss out!
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